pengantar
PCB Majelis adalah sebuah proses yang membutuhkan pengetahuan tidak hanya dari komponen PCB dan perakitan, tetapi juga dari dicetak desain papan sirkuit, fabrikasi PCB dan pemahaman yang kuat dari produk akhir. Perakitan papan sirkuit adalah hanya satu bagian dari teka-teki untuk memberikan produk yang sempurna pertama kalinya.
San Francisco Sirkuit merupakan solusi satu atap untuk semua layanan papan sirkuit sehingga kita sering bercokol dengan proses produksi PCB dari desain untuk perakitan. Melalui jaringan yang kuat kami perakitan sirkuit dan manufaktur mitra yang telah terbukti, kami dapat memberikan kemampuan yang paling canggih dan hampir tak terbatas untuk prototipe atau produksi aplikasi PCB Anda. Menyelamatkan diri sendiri kesulitan yang datang dengan proses pengadaan dan berurusan dengan vendor beberapa komponen. Ahli kami akan menemukan Anda bagian terbaik untuk produk akhir Anda.
PCB Assembly Layanan:
Perakitan prototipe cepat-turn
Turn-key perakitan
Parsial perakitan turn-key
perakitan konsinyasi
RoHS compliant perakitan bebas timah
Non-RoHS perakitan
coating konformal
Akhir kotak-membangun dan kemasan
Proses PCB Majelis
Pengeboran ----- Paparan ----- Plating ----- Etaching & melucuti ----- Punching ----- Uji Listrik ----- SMT ----- gelombang solder --- --Assembling ----- ICT ----- Fungsi Pengujian ----- Suhu & Kelembaban Pengujian
Layanan pengujian
X-Ray (2-D dan 3-D)
BGA X-Ray Inspeksi
AOI Testing (Automated Optical Inspection)
Pengujian ICT (In-Circuit Testing)
Fungsional Pengujian (di papan & sistem level)
terbang Probe
kemampuan
Permukaan Gunung Teknologi / Suku Cadang (SMT Majelis)
Melalui-Hole Perangkat / Parts (THD)
Campuran Parts: SMT & THD perakitan
BGA / Micro BGA / uBGA
QFN, POP & timah kurang chip
2800 pin-count BGA
0201/1005 komponen pasif
0,3 / 0,4 pitch
PoP Paket
Flip-chip di bawah-diisi CCGA
BGA Interposer / Stack-up
dan banyak lagi ...
Detail produk:
Syarat-syarat pembayaran & pengiriman:
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Menyoroti: | pcb assembly process,circuit board assembly |
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Electronic PCBA Design PCB circuit board , pcb design layout Double-Sided
Specifications
1, No MOQ;
2, OEM SMT&DIP Service;
3, 1-22 Layer;
4, UL.ROSH SGS Certification;
5, High quality, low cost&fast delivery.
Welcome to Rigao Electronics .CO.,Ltd.
- Contract Manufacturing
- Engineering Services
- PCB Design & Assembly and copy service
- Prototyping
- Components purchasing
- Cable and Wire Assemblies
- Plastics and Molds
- Fast turn around
1. Double-Sided FR4 material 1 oz copper pcb board
2. Green solder mask, Immersion gold
3. with Competitive price
General Specifications Capability
Material Requirements:
Size | Max.Finshed Size | 20.9”x24.4”(530mm x 620mm ) |
Board Thickness | Standard | 0.004”to0.16 ” ±10% ( 0.1mmto4.0mm±10% ) |
Min. | Single/ Double-sided:0.008”±0.004”(0.2mm ±0.1mm) | |
4-layer:0.01”±0.008”(0.4mm ±0.1mm) | ||
8-layer :0.01”±0.008”(0.4mm ±0.1mm) | ||
Bow and twist | < 7/1000 | |
Copper Weight | Outer Cu weight | 0.5oz ~ 3.0oz |
Inner Cu wight | 0.5oz ~ 3.0oz | |
Laminate Materials | FR-4,FR-1,,FR-2,CEM-1,CEM-3 |
Process Requirements:
Solder Mask | Color | green,light green,white,black,dark brown,yellow,red,blue |
Min. solder mask clearance | 0.003”(0.07mm) | |
Thickness | 0.0005”-0.0007”(0.012mm-0.017mm) | |
Silkscreen | Color | White,black,yellow,red,blue,green |
Min. Size | 0.006”(0.15mm) | |
Surface Finish | HASL,HASL pb free,immersion gold,immersion silver,immersion tin,O.S.P (Entek),S/G plating,ENEPIG,G/F plating,carbon |
Quality Control:
Electrical testing | Flying Probe Tester | Y |
Controlled Impedance | Tolerance | ±10% |
Impedance tester | Tektronix TDS8200 | |
Routing | End Mills Test | ± 0.006”(0.15mm) |
CNC Tolerance | ±0.004”(0.1mm) | |
V-Cut Depth V-cut | FR-4(1/3+-0.1mm);FR-1,FR-2,CEM-1,CEM-3(1/2+-0.1mm) | |
V-cut angle V-CUT | 15°,18°,30° | |
V-CUT | line,hole,V-shape |
Manufacturing Capability for PCB Board
1). Material type: CEM-3,FR-4,FR-4-TG170/TG180,Halogen Free,Rogers,Arlon,Taconic,Isola,PTFE, Bergquist
2). Surface Treatment: HASL,HASL lead-free,HAL,Flash gold,immersion gold,OSP,Gold Finger
Palting,Selective thick gold plating, immersion silver,immersion tin, Carbon ink,peelable mask
3). Solder mask colour: Green/MATT Green/Blue/Yello/White/Black/Red
4). Board Size: 650mm*1000mm
5). Board Layer: 1L-26L
6). Board thickness: 0.2mm to 6.0mm
7). Finished Copper thickness: 0.5 OZ to 6 OZ
8). Min. drilled hole size: 3mil (0.075mm)
9). Min. Line width/Line spacing: 3mil/3mil
10). Copper thickness in hole: >20um
11). Board thickness tolerance: ±10%
12). Outline tolerance: Routing:±0.1mm,Punching:±0.1mm
13). Hole tolerance: PTH: ±0.076mm , NPTH: ±0.05mm
14). impedance control tolerance: ±10%
15). Warp and Twist: <0.75%
16). Tested by:Flying-Probe Tester, Fixture tester , Visual Inspection
17). Special requirements: Buried and blind vias, impedance control, thick Cu PCB,selectivity plating gold 30 microinch
18). Profiling: Punching, Routing, V-CUT, Beveling
19). Certificate: UL,ISO 9001,ISO14001,ROHS
20). We have a sound quality management system,Ensure the quality of all products
High precision manufacturing
Our Principle is simple, “Act by heart, Make the best.”
Our Strength is distinct, “Years of experiences in PCB and PCBA field”
Our Goal is achievable, “ To be the most reliable supplier of PCB and PCBA.”
Our Orientation is clear, “Focus on prototypes and low to medium volume business ”
Kontak Person: Miss. aaa
Tel: 86 755 8546321
Faks: 86-10-66557788-2345