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The board quality is very good! We have been WonDa’s customer for more than 4 years. Your good service and quality is too good.

—— Jay

Cooperation is very satisfactory and the Company of the past few years, we are very willing to continue long-term cooperation.

—— Rob

The board quality is very good! I’m surprised with the low cost and quick delivery. It is totally out of my expectation. I will definitely come back.

—— Victoria, Australia

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Cell Phone PCB

pengantar

Kita bisa membuat single / double berdinding papan, papan multi-layer, papan kepadatan tinggi, termasuk MLB dengan buta / dimakamkan melalui lubang

Bahan Dasar Utama

FR-1, FR-2, FR-4, CEM-1, CEM-3, Frekuensi Laminate Tinggi dengan berbagai konstanta dielektrik (diimpor atau dari pemasok lokal), dasar Aluminium laminasi, Logam inti Aluminium
Kami memilih yang terbaik pemasok bahan dasar sebagai mitra kami, seperti KB dan Shengyi untuk menjamin produk kami dengan kualitas tinggi.

permukaan Finish

Udara Im Hot p memimpin HASL gratis, perendaman emas / perak / timah, plating emas, OSP

Dewan Tebal

Dalam inti ketebalan 0.15-1.5mm, jadi papan ketebalan 0.20-3mm

Layanan

* - Audit dokumen komprehensif untuk mencegah kesalahan dalam PCB Gerber dan Bom.

* - Sarankan pengganti kualitas terbaik dengan harga yang lebih rendah.

* - Rekayasa dukungan untuk tes dan memberikan saran untuk produksi massal.

* - Sarankan metode pengiriman terbaik.

* - Masuk NDA untuk menjaga desain Anda aman.

FR4 10 Layers Prototype Cell Phone PCB Board Gold Plating , ENIG / 1.2mm Thickness

Name: FR4 10 Layers Prototype Cell Phone PCB Board Gold Plating , ENIG / 1.2mm Thickness
Brand: WonDa
SKU: WonDa
Price: 1 USD
Availability: InStock
Rating: 4.5 (194 reviews)

Gambar besar : FR4 10 Layers Prototype Cell Phone PCB Board Gold Plating , ENIG / 1.2mm Thickness

Detail produk:

Place of Origin:	Shenzhen, China
Nama merek:	WonDa
Sertifikasi:	CE, ROHS, UL
Number Of Layers:	10-Layer
Base Material:	FR4
Copper Thickness:	1OZ
Board Thickness:	1.2mm
Min. Hole Size:	0.2mm
Min. Line Width:	0.1mm
Min. Line Spacing:	0.1mm
Surface Finishing:	ENIG
Soldermask Colour:	blue/white/green/yellow...
Process Finish:	OSP, HASL, Gold Plating, ENIG
Other Service:	PCB copy, PCB assembly service

Kontak

Detil Deskripsi produk

Cahaya Tinggi:

mobile phone pcb

mobile phone circuit board

FR4 10 Layers Prototype Cell Phone PCB Board Gold Plating , ENIG / 1.2mm Thickness

Specifications

1.Multi-layer pcb
2.UL,SGS,ROHS,IS09001,CEC
3.Fast delivery with high quality
4.12 years in Pinted circuit board

1.Professional manufacturer of PCB and PCB assembly specialized in single-sided PCB, double-sided PCB, multilayer PCB, PCB layout and design and PCB assembly

2. Material Type: FR4,non-halogen material ,Aluminium Base,Cooper Base,high frequency material ,Thick copper foil,94-V0(HB),PI Material,HIGH TG:SL S1000-2,ITEQ:IT180

3. Surface treatment: HAL,Immersion Gold,Immersion Tin,Immersion silver,Gold Finger,OSP,HAL(Immersion Gold,OSP,Immersion silver,Immersion Tin)+Gold Finger

Advantage

1.PCB factory directly
2.PCB Have the comprehensive quality control system
3.PCB good price
4.PCB quick turn delivery time from 48hours.
5.PCB certification(ISO/UL E354810/RoHS)
6.8 years experience in exporting service
7.PCB is no MOQ/MOV.
8.PCB is high quality.Strict through theAOI(Automated Optical Inspection),QA/QC,fly porbe ,Etesting

The information about our company's process capacity for your reference:

	Specification Inch (mm)
Material	FR-4 / Hi Tg FR-4 / Lead free Materials (RoHS Compliant) /CEM-3/CEM-1/Aluminium
Layer No.	1-30
Board thickness	0.015"(0.4mm)-0.125"(3.2mm)
Board thickness
Board Thickness Tolerance	±10%
Cooper thickness	1/2OZ-3OZ
Impedance Control	±10%
Warpage	0.075%-1.5%
Peelable	0.012"(0.3mm)-0.02’(0.5mm)

Min Trace Width (a)	0.005"(0.125mm)
Min Space Width (b)	0.005"(0.125mm)
Min Annular Ring	0.005"(0.125mm)
SMD Pitch (a)	0.012"(0.3mm)
BGA Pitch (b)	0.027"(0.675mm)
Regesiter torlerance	0.05mm

Min Solder Mask Dam (a)	0.005"(0.125mm)
Soldermask Clearance (b)	0.005"(0.125mm)
Min SMT Pad spacing (c)	0.004"(0.1mm)
Solder Mask Thickness	0.0007"(0.018mm)

Hole size	0.01"(0.25mm)-- 0.257"(6.5mm)
Hole Size Tol (+/-)	±0.003"(±0.0762mm)
Aspect Ratio	6:1
Hole Registration	0.004"(0.1mm)
Plating
HASL	2.5um
Lead free HASL	2.5um
Immersion Gold	Nickel 3-7um Au:1-3u''
OSP	0.2-0.5um
Outline
Panel Outline Tol (+/-)	±0.004''(±0.1mm)
Beveling	30°45°
V-cut	15° 30° 45° 60°
Certificate	ROHS ISO9001:2000 TS16949 SGS UL

Label:

papan sirkuit ponsel,

pcb ponsel

Rincian kontak

PCB Board Online Marketplace

Kontak Person: Miss. aaa

Tel: 86 755 8546321

Faks: 86-10-66557788-2345

FR4 10 Layers Prototype Cell Phone PCB Board Gold Plating , ENIG / 1.2mm Thickness

Cell Phone PCB

FR4 10 Layers Prototype Cell Phone PCB Board Gold Plating , ENIG / 1.2mm Thickness

Detail produk:

mobile phone pcb

mobile phone circuit board

FR4 10 Layers Prototype Cell Phone PCB Board Gold Plating , ENIG / 1.2mm Thickness

Specifications

papan sirkuit ponsel,

papan sirkuit ponsel,

pcb ponsel

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