pengantar
Kita bisa membuat single / double berdinding papan, papan multi-layer, papan kepadatan tinggi, termasuk MLB dengan buta / dimakamkan melalui lubang
Bahan Dasar Utama
FR-1, FR-2, FR-4, CEM-1, CEM-3, Frekuensi Laminate Tinggi dengan berbagai konstanta dielektrik (diimpor atau dari pemasok lokal), dasar Aluminium laminasi, Logam inti Aluminium
Kami memilih yang terbaik pemasok bahan dasar sebagai mitra kami, seperti KB dan Shengyi untuk menjamin produk kami dengan kualitas tinggi.
permukaan Finish
Udara Im Hot p memimpin HASL gratis, perendaman emas / perak / timah, plating emas, OSP
Dewan Tebal
Dalam inti ketebalan 0.15-1.5mm, jadi papan ketebalan 0.20-3mm
Layanan
* - Audit dokumen komprehensif untuk mencegah kesalahan dalam PCB Gerber dan Bom.
* - Sarankan pengganti kualitas terbaik dengan harga yang lebih rendah.
* - Rekayasa dukungan untuk tes dan memberikan saran untuk produksi massal.
* - Sarankan metode pengiriman terbaik.
* - Masuk NDA untuk menjaga desain Anda aman.
Detail produk:
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Cahaya Tinggi: | mobile phone pcb,mobile phone circuit board |
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1.Professional manufacturer of PCB and PCB assembly specialized in single-sided PCB, double-sided PCB, multilayer PCB, PCB layout and design and PCB assembly
2. Material Type: FR4,non-halogen material ,Aluminium Base,Cooper Base,high frequency material ,Thick copper foil,94-V0(HB),PI Material,HIGH TG:SL S1000-2,ITEQ:IT180
3. Surface treatment: HAL,Immersion Gold,Immersion Tin,Immersion silver,Gold Finger,OSP,HAL(Immersion Gold,OSP,Immersion silver,Immersion Tin)+Gold Finger
Advantage
1.PCB factory directly
2.PCB Have the comprehensive quality control system
3.PCB good price
4.PCB quick turn delivery time from 48hours.
5.PCB certification(ISO/UL E354810/RoHS)
6.8 years experience in exporting service
7.PCB is no MOQ/MOV.
8.PCB is high quality.Strict through theAOI(Automated Optical Inspection),QA/QC,fly porbe ,Etesting
The information about our company's process capacity for your reference:
Specification Inch (mm) |
|
Material |
FR-4 / Hi Tg FR-4 / Lead free Materials (RoHS Compliant) /CEM-3/CEM-1/Aluminium |
Layer No. |
1-30 |
Board thickness |
0.015"(0.4mm)-0.125"(3.2mm) |
|
|
Board Thickness Tolerance |
±10% |
Cooper thickness |
1/2OZ-3OZ |
Impedance Control |
±10% |
Warpage |
0.075%-1.5% |
Peelable |
0.012"(0.3mm)-0.02’(0.5mm) |
|
|
Min Trace Width (a) |
0.005"(0.125mm) |
Min Space Width (b) |
0.005"(0.125mm) |
Min Annular Ring |
0.005"(0.125mm) |
SMD Pitch (a) |
0.012"(0.3mm) |
BGA Pitch (b) |
0.027"(0.675mm) |
Regesiter torlerance |
0.05mm |
|
|
Min Solder Mask Dam (a) |
0.005"(0.125mm) |
Soldermask Clearance (b) |
0.005"(0.125mm) |
Min SMT Pad spacing (c) |
0.004"(0.1mm) |
Solder Mask Thickness |
0.0007"(0.018mm) |
|
|
Hole size |
0.01"(0.25mm)-- 0.257"(6.5mm) |
Hole Size Tol (+/-) |
±0.003"(±0.0762mm) |
Aspect Ratio |
6:1 |
Hole Registration |
0.004"(0.1mm) |
Plating
|
|
HASL |
2.5um |
Lead free HASL |
2.5um |
Immersion Gold |
Nickel 3-7um Au:1-3u'' |
OSP |
0.2-0.5um |
Outline
|
|
Panel Outline Tol (+/-) |
±0.004''(±0.1mm) |
Beveling |
30°45° |
V-cut |
15° 30° 45° 60° |
Certificate |
ROHS ISO9001:2000 TS16949 SGS UL |
Kontak Person: Miss. aaa
Tel: 86 755 8546321
Faks: 86-10-66557788-2345